Fig. 3From: Automated analysis of evolving interfaces during in situ electron microscopyBright-field image of Cu electrodeposition in the nanoaquarium using the same electrochemical configuration (400 nA current), electrolyte, beam conditions and liquid thickness as Fig. 1. a An extracted growth edge from copper electrodeposition. Selected frames from Video S3 are shown. b Maximum, minimum, and average growth height as functions of frame number. c RMS roughness of the growth height as a function of time. d Contours of the autocorrelation function of the surface roughness as a function of spatial shift and frame number. e A heat map of the normal growth speedBack to article page